Mr. Leith is the VP of Engineering & Technology of MicroConnex, a position he has held since joining the Company in July 2016. Mr. Leith manages the applications engineering, process engineering, and laser engineering functions at MicroConnex, and is responsible for development and execution of the technology roadmap. Prior to joining MicroConnex, Mr. Leith held engineering management and business development positions in microelectronic, MEMS device design and fabrication, product development, and specialty chemical production. Mr. Leith’s experience encompasses tenures in both the public and private sectors, including positions with Sandia National Laboratory, Hewlett-Packard Company, Pacific Northwest National Laboratory, and RMT International. Mr. Leith has been issued ten U.S. patents for innovations in microfluidic, memory, and display technologies. He holds B.S. and Ph.D. degrees in Chemical Engineering from the University of Washington, and an M.S. in Chemical Engineering from the University of Colorado.
Mr. Ishizaka is the VP Manufacturing of MicroConnex, a position he has held since joining the Company in 2013. Mr. Ishizaka oversees the flex, laser, and sputtering production departments, as well as the operations, support, facilities, and IT departments. Prior to joining MicroConnex, Mr. Ishizaka worked as the VP of Operations in the medical battery systems division at [Micro Power]. During his tenure at Micro Power, Mr. Ishizaka grew the Operations team from a $7 million organization to a $70 million organization. He successfully drove the implementation of ISO 13485 and FDA quality system requirements within a 2 year time frame. Mr. Ishizaka received his BSME in Manufacturing from Oregon Institute of Technology.
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