Mr. Leith is the VP of Engineering & Technology of MicroConnex, a position he has held since joining the Company in July 2016. Mr. Leith manages the applications engineering, process engineering, and laser engineering functions at MicroConnex, and is responsible for development and execution of the technology roadmap. Prior to joining MicroConnex, Mr. Leith held engineering management and business development positions in microelectronic, MEMS device design and fabrication, product development, and specialty chemical production. Mr. Leith’s experience encompasses tenures in both the public and private sectors, including positions with Sandia National Laboratory, Hewlett-Packard Company, Pacific Northwest National Laboratory, and RMT International. Mr. Leith has been issued ten U.S. patents for innovations in microfluidic, memory, and display technologies. He holds B.S. and Ph.D. degrees in Chemical Engineering from the University of Washington, and an M.S. in Chemical Engineering from the University of Colorado.