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A typical 20 micron wide cross-section of a micro-via.

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This small, thin Flex PCB that measures a little over ½ inch with rows of gold plated pads for wire bonding.

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This thin FPC has flying leads made with MCX’ expert laser ablation capability.

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These long thin tight geometry Flex Pcbs show a good example of “nesting” to get the maximum number of parts on a panel to support sub- 2mil trace / space.

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This interposer-Flex PCB demonstrates extremely fine line / pitch in the center of the part with every conductor-line connecting the inner pads with edge pads for a solder-on connector.

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Thin flex pcb with large tooling holes and small pads / bumps.

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Coverlay of blue soldermask, this FPC show intricate laser windowing.

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Referenced by a vintner’s corkscrew, this is an example of 1000 parts on a 6” X 6” panel. Panelizing of this nature is directly related to costs of these super small parts. The geometries support a capacitor by way of the shape and thickness of the copper traces in addition to plated through vias that solder onto a conventional connector.

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Thin, almost transparent substrate is ½ mil thick (thin), has multi-layers and gold plated pads.

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These “thick” round discs are less than 7mm diameter, are multi-layer and small (referenced in size w/ baby aspirin). Thickness is approximately 5mils.

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Size referenced to a small drill / screwdriver bit, this Flex PCB is thin and light, has intricate laser slots and copper “bumps”.

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This small ultrasound flex is smaller than 1/3 of a penny has stringent laser final cut to maintain the geometries needed to align with the piezo device that it will be bonded to.

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Referencing perspective of standard reading glasses, this small 4 layer Flex PCB has sub 1.5mil trace / space and required micron-level registration from layer to layer to support the micro-vias.

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Long (by MCX’ standards), this interconnect cable has an EMI shielding layer and SMT-Connector assembly.

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Compared in reference to a baby aspirin, this part has very tight spacing of traces interconnecting the 2 large rectangular areas that have pads for the smallest of IC’s and passive components. The interconnect lines are sub 3 mil trace / space.

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