Check out the latest information and findings on flexible circuit technologies.
Enhancing Flex PCBs with Advanced Electroplating Techniques Electroplating is a critical process in the manufacturing of flexible printed circuit boards (FPCBs), significantly enhancing their conductivity, durability, and overall performance. At MicroConnex, we offer a variety of advanced electroplating options to meet diverse application needs, including ENIG, NI/Au, ENPIG, Immersion Sn, and Immersion Ag. ENIG (Electroless […]
Precision in Flex PCB Manufacturing: Laser Direct Imaging (LDI) In the realm of flexible printed circuit boards (FPCBs), achieving high precision and flexibility is crucial. One standout technology in this domain is Laser Direct Imaging (LDI). Unlike traditional photolithography, LDI offers unique advantages that can significantly enhance the manufacturing process of flex PCBs. Understanding Laser […]
Precision Meets Flexibility: Laser Micro-Machining for Flex PCB Manufacturing As the demand for smaller, more versatile electronic devices grows, the need for precise and intricate manufacturing processes has become paramount. One such technology that is redefining the landscape of flexible printed circuit board (FPCB) manufacturing is laser micro-machining. At MicroConnex, we leverage this cutting-edge technology […]
In the rapidly evolving landscape of electronic design, the quest for smaller, more flexible, and highly reliable components drives continuous innovation. While traditional methods dominate the manufacturing of flexible printed circuit boards (FPCBs), there is a groundbreaking technology that is often overlooked: sputtering. At MicroConnex, we leverage this advanced technique to offer unique solutions in […]